Directions and Opportunities in Advanced Packaging Technology
Ram Viswanath is the Director of Architecture for Microelectronics Packaging at Intel. He is responsible for the introduction of new packaging technologies for Client, Server, Handheld, Programmable, Graphics and Communication Processors. He has more than 25 patents in the area of microelectronics package architecture, heat transfer and testability of processors. He has authored book chapters and numerous technical papers in conferences, IEEE journals and the prestigious Intel Technology Journal. Ram has a Ph.D in Mechanical and Aerospace Engineering from Rutgers University and is a member of IEEE.