Packaging Solutions and Hardware Technology for 5G Mobility Systems
Convergence of Communications for Wide Area Networks (WANs), from 2G to 4G LTE, is first reviewed. We identify and illustrate the packaging solutions in realizing state-of-the-art WAN devices. Underlying packaging solutions employed to satisfy massive product demands (required by products such as handsets and portable devices) are shown. A simple MTM (More Than Moore) packaging map is drawn to further highlight the trends in packaging WAN products on the horizon. Secondly, we review the key characteristics for 5G mobility. We then identify the key hardware technologies that are needed to fulfill the promises of 5G mobility; which include Array antenna technologies in system design and Stacking & Planar technologies in manufacturing.
Professor Lih-Tyng Hwang obtained PhD from University of Pennsylvania; he joined MCNC, RTP (Research Triangle Park), NC in 1985. Later, he worked for Motorola at Tempe, AZ and Schaumburg, IL, Semiconductor Products Sector and Motorola Labs, respectively. In 2009, he became a professor at NSYSU, Kaohsiung, Taiwan. He is an author of a book, "3D IC and RF SiPs, advanced stacking and planar solutions for 5G mobility," published in May of 2018. He is an IEEE Life Fellow.