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EDAPS 2018 Keynote Presentations

Keynote-1

Ram Viswanath , Intel - Directions and Opportunities in Advanced Packaging Technology


Keynote-2

Dr. M. Manjunatha Nayak, IISc, Bangalore Electronics Packaging: MEMS Pressure Transducers for Aerospace application - A case study


Keynote-3

Prof. Lih-Tyng Hwang, NSYSU Packaging Solutions and Hardware Technology for 5G Mobility Systems