Power Integrity analysis of Power Delivery networks
Arun Chandrasekhar is a Principal Engineer at Intel India working on package design for server products as well as next generation packaging tools and technologies. He teaches packaging courses at the Indian Institute of Science and NIT, Trichy for M.Tech/B.Tech students. He has published over 30 papers at international journals and conferences with 6 patents awarded/pending. He is an active IEEE member and was the co-founding and ex-chair of the EPS Bangalore chapter and the EDAPS 2014 conference. He obtained his PhD from IMEC / KU Leuven Belgium in Microsystems packaging in 2004, M.Tech from IISc Bangalore and B.E. from the College of Engg., Guindy, Chennai. He was a research intern at IBM TJ Watson Centre in 2004.